Ultra-Rugged Computer-on-Modules for Mission Critical Applications

Computer-on-modules for extreme environmental conditions with soldered RAM and LPDDR5x memory.

Congatec, an embedded and edge computing technology provider, has launched six new computer-on-modules, the conga-TC675r COM Express Compact modules. Powered by the 13th Gen Intel Core processors, the modules are built to function reliably in harsh environments, suitable for extreme temperature fluctuations. They can withstand temperatures ranging from -40°C to +85°C. 

The modules use Intel’s Raptor lake microarchitecture and are targeted at OEM applications in both manned and unmanned rail and off-road vehicles. These applications include mining, construction, agriculture, forestry, and other mobility applications outside paved roads.

With soldered random access memory (RAM), these modules comply with the highest standards for shock and vibration resistance, making them compliant with the highest railway standards. This makes them suitable for stationary devices and outdoor applications in critical infrastructure protection against natural disasters like earthquakes.

The modules have up to 14 cores and 20 threads and are supported by LPDDR5x memory. Thus, they can offer significant parallel processing and multitasking capabilities within optimized power budgets. The soldered LPDDR5x memory supports in-band error code correction (IBECC), enhancing data integrity for mission-critical applications without needing special memory types.

The Intel processors feature a hybrid architecture with performance-cores (P-cores) and efficient-cores (E-cores) on a single chip. This leads to an improved performance per watt ratio and reduced power costs over their lifespan. The modules also support Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC), adding to their industrial-grade capabilities.

Congatec’s ecosystem for these modules includes efficient cooling solutions, optional conformal coating for protection, evaluation carrier boards, and carrier board schematics. For edge computing scenarios, the modules can be equipped with a pre-evaluated real-time hypervisor from real-time systems, supporting real-time operations with no additional latency. 

Additional services include shock and vibration testing for custom system designs, temperature screening, high-speed signal compliance testing, design-in services, and training sessions to ease the use of their embedded computer technologies.

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